DRIX is offering substrate and wafer processing services to other manufactureres
and other industries.

The services we offer are : 

• Aluminium deposition on substrates any size up to 6x6 inch.
• Chrome deposition on substrates any size up to 6x6 inch.
• Thermal processing, SiO2 growth dry and wet on 4 inch or 100mm substrates.
• Nitride deposition on substrates up to 6 inch diameter.
• Deposition of photo emulsion layers on basically any material op to 6 inch or 150mm size.
• Backgrinding down to 250µm, exclusively on 100mm Si substrates.
• Backmetal deposition (Ti/NiV/Ag stack).
• Deposition if Oxide/Nitride (PEVCD or LPCVD) and Polysilicon layers.
• Coating of precision mirrors.
• Patterned glass products for industrial use (eg : encoders, signal tracks on glass) or lighting industry.
• Dichroic colour filters with high uniformity and high precision (up to 5nm wavelength precision)
• Hot mirror stack deposited directly onto Si-Wafers up to 200mm size, to serve as a patternable IR-blocking filter.